| Mfg Part Number: CY6116-55LMB | Alternate P/N: CY611655LMB | NSN : 5962-01-302-0502 |
| NIIN : 013020502 | CAGE Code : 65786 | Manufacturer: Cypress Semiconductor Inc |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic | Description: Microcircuit Memory |
If you are in the market for Microcircuit Memory items, such as nsn part number CY6116-55LMB, then look no further than Integrated Jet Parts! We currently have this Cypress Semiconductor Inc item in stock and it is listed under the NSN 5962-01-302-0502, allowing you to locate it quickly and easily. As such, we invite you to fill out an RFQ form for this component to receive a customized quote within 15 minutes or less. For ease of item identification, nsn part number CY6116-55LMB with the specific NSN 5962-01-302-0502 can also be found alongside CAGE Code 65786; however, we carry an array of other NSN products, all of which have been sourced from trusted manufacturers like Cypress Semiconductor Inc.
At Integrated Jet Parts, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, alongside a strict NO CHINA SOURCING pledge to ensure that customers can always rely on the caliber of our offerings. Initiate the purchasing process for nsn part number CY6116-55LMB from Cypress Semiconductor Inc today and see how Integrated Jet Parts can serve as your strategic sourcing partner. For additional inquiries, call or email us directly; we are on standby 24/7x365!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-302-0502 Item Description: Microcircuit Memory | 5962 | 013020502 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Cy6116-55lmb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MEMORY | ADAQ | BODY LENGTH0 442 INCHES MINIMUM AND 0 460 INCHES MAXIMUM |
| MEMORY | ADAT | BODY WIDTH0 442 INCHES MINIMUM AND 0 460 INCHES MAXIMUM |
| MEMORY | ADAU | BODY HEIGHT0 060 INCHES MINIMUM AND 0 100 INCHES MAXIMUM |
| MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 0 WATTS |
| MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
| MEMORY | AFJQ | STORAGE TEMP RANGE-55 0150 0 DEG CELSIUS |
| MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND WENABLE |
| MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
| MEMORY | CQSZ | INCLOSURE CONFIGURATIONLEADLESS FLAT PACK |
| MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MEMORY | CQZP | INPUT CIRCUIT PATTERN22 INPUT |
| MEMORY | CRHL | BIT QUANTITY16384 |
| MEMORY | CSWJ | WORD QUANTITY2048 |
| MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORC-4 MIL-M-38510 |
| MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC120 00 MILLIAMPERES REVERSE CURRENT DC ABSOLUTE |
| MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
| MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC7 0 VOLTS MAXIMUM POWER SOURCE |
| MEMORY | CZEQ | TIME RATING PER CHACTERISTIC55 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 55 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
| MEMORY | CZER | MEMORY DEVICE TYPERAM |
| MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
| MEMORY | TTQY | TERMINAL TYPE AND QUANTITY28 LEADLESS |
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