| Mfg Part Number: DEL1403N-70LM | Alternate P/N: DEL1403N70LM | NSN : 5962-01-248-5010 |
| NIIN : 012485010 | CAGE Code : 60911 | Manufacturer: Sgs Thomson Microelectronics Inc |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic | Description: Microcircuit Memory |
If you are in the market for Microcircuit Memory items, such as nsn part number DEL1403N-70LM, then look no further than Integrated Jet Parts! We currently have this Sgs Thomson Microelectronics Inc item in stock and it is listed under the NSN 5962-01-248-5010, allowing you to locate it quickly and easily. As such, we invite you to fill out an RFQ form for this component to receive a customized quote within 15 minutes or less. For ease of item identification, nsn part number DEL1403N-70LM with the specific NSN 5962-01-248-5010 can also be found alongside CAGE Code 60911; however, we carry an array of other NSN products, all of which have been sourced from trusted manufacturers like Sgs Thomson Microelectronics Inc.
At Integrated Jet Parts, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, alongside a strict NO CHINA SOURCING pledge to ensure that customers can always rely on the caliber of our offerings. Initiate the purchasing process for nsn part number DEL1403N-70LM from Sgs Thomson Microelectronics Inc today and see how Integrated Jet Parts can serve as your strategic sourcing partner. For additional inquiries, call or email us directly; we are on standby 24/7x365!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item Description: Microcircuit Memory | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Del1403n-70lm | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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